The electronics giant Qualcomm recently unveiled a new set of technologies that included sophisticated processors and fingerprint scanner sensors like never before.
One of the highlights of these technologies was the 3D Sonic Max fingerprint sensor, which is ultrasonic and designed to be installed in phones and smart devices.
The unique feature of this sensor is that it can handle up to 17 times more space than the current fingerprint sensors, meaning that it will enable the phone user to unlock the screen using two fingers together, for example, and the speed of its performance in fingerprint analysis will be greater The amount is made more points.
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Qualcomm also unveiled the Snapdragon 865 processor and the Snapdragon X55 5G modem, which are designed to work with devices and phones that will work with 5G cellular networks, to provide very fast data download speed.Experts point out that the Sonic sensors produced by Qualcomm in recent years have been used in the Galaxy phones from Samsung, so it is expected that the new 3D Sonic Max will appear in the phone S11, which may come to market early next year.
Source: Qualcomm
